compact les with high light density
latest advanced phosphor technology, high color consistency
thermal-electric isolation copper substrate, safe & stable
intersecting distribution of 5 colors, optimized color-mixing
application area
entertainment lighting
architectural lighting
medical illumination, fiber optics
event lighting
stage lighting projection
small les only 16.3mm eutectic flip-chip bonding technique higher forward voltage, lower forward current, excellent effect of color-mixing for 6 colors leds light source copper mcpcb, high thermal conductivity